2015 The 4th International Conference on Manufacturing Engineering and Process (ICMEP 2015)
Paris, France, April 13-14, 2015
http://www.icmep.org/
2015 The 4th International Conference on Manufacturing Engineering and Process (ICMEP 2015) will be held in Paris, France during April 13-14, 2015. Science and Engineering Insititute host this conference annually. This conference is a platform for researchers, engineers, academicians as well as industrial professionals from all over the world to present their research results and development activities in Manufacturing Engineering and Process. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration.
1. Call For Paper
Topics: The conference is soliciting state-of-the-art research papers in the following areas of interest:
Advanced Materials Engineering and Technology
Applied thermodynamics, heat transfer, energy conversion
Electronics and Integrated Circuits, Embedded Technology and Applications
Electrical Engineering and Electric Machines
Engineering design and graphics
Instrumentation and measurement Technologies
Manufacturing and Industrial Engineering, Management Applications
Mechatronics and control theory
Modern Control, Automation and reverse engineering
Mathematics - in particular, calculus, differential equations, statistics, and linear algebra
New Technology, Method and Technique in Civil Engineering
Power System and Energy Engineering, Its Applications
Robotics and Its Applications
System Design, Modelling, Simulations and Optimization
Data and Intelligent Information Processing, Its Applications
Signal and Acoustics Acquisition and Processing
Information Technologies and Networks: Its Applications
2. Submission Method
1. Full paper (presentation & publication) please submit the paper via Electronic Submission System or email: This email address is being protected from spambots. You need JavaScript enabled to view it..
2. Abstract (presentation only), please send the abstract to conference email: This email address is being protected from spambots. You need JavaScript enabled to view it..
3. Important Date
Submission Deadline Before December 05, 2014
Notification Date On December 25, 2014
Registration Deadline January 15, 2015
4. Venue
Hotel Novotel Paris Creteil le Lac
http://www.novotel.com/gb/hotel-0382-novotel-paris-creteil-le-lac/index.shtml
5. Committee
International Advisory Committee
Assoc. Prof.You-Jin Park, Chung-Ang University, Korea
Prof Luigi Benedicenti, Software Systems Engineering, Regina, Canada
Prof. Philippe CASTAGLIOLA, Inst. Univ. de Technologie de Nantes, France
Prof. Alain Bernard, Ecole Centrale de Nantes, France
Prof. Joost Duflou, Katholieke Universiteit Leuven, Belgium
Conference Chair
Prof. Bale V. Reddy, University of Ontario Institute of Technology (UOIT), Canada
Prof. Michel Cotsaftis, LACSC/ECE, Paris, France
Program Chair
Prof.MOGNOL Pascal, IRCCyN, Ecole normale supérieure de Rennes, France
Dr.Alexey Vereschaka, Moscow State Technological University STANKIN, Russia
Associate Professor Francisco Ortin, Computer Science Department of the University of Oviedo Spain, Spain
Associate Professor.Dr.Balan D. George, German-Romanian University of Sibiu, Romania
Pro.Bor-Jang Tsai, Chung Hua University Taiwan
Asst. Prof.Mário S. Ming Kong, University Lisbon, Portugal
Technical Committee
Prof.Ting-Chuen Pong, Hong Kong University of Science and Technology, Hong Kong
Dr. Santoso Wibowo, Central Queensland University, Australia
Prof. S. E. Oraby, PAAET, Kuwait
Assoc. Prof Kittisak Kerdprasop, Suranaree University of Technology, Thailand
Prof.Mehmet Savsar, Kuwait University, Kuwait
Prof. Yasuhide Mochida, Graduate school of Science & Engineering, Ritsumeikan University, Japan
Asst. Prof.Sureerat Polsilapa , Kasetsart University, Thailand
Dr. Manish A. Kewalramani, Abu Dhabi University, UAE.
Dr. YIP Mum Wai, Department of Mechanical Engineering, Tunku Abdul Rahman University College, Malaysia
Assoc. Prof Dr.Yusri Yusof, Faculty of Mechanical and Manufacturing Engineering , Universiti Tun Hussein Onn Malaysia
Dr. Burra.Venkata Durga Kumar, Binary University, Malaysia
Prof Nittaya Kerdprasop, Suranaree University of Technology Thailand
Dr Nazri Kama , Advanced Informatics School, Universiti Teknologi Malaysia
Prof.Saad M. Darwish, computer science, Alexandria university, Egypt
Asst. Prof. Mahdi Alajmi, College of Technological Studies, PAAET, Kuwait
Assoc. Prof. Supakorn Pukird, Ubon Ratchathani University, Thailand
Dr. Nico Hanenkamp, Freudenberg NOK Sealing Technologies Plymouth/MI/USA
Prof. Renjun PEI, Columbia University, USA
Dr.Shadi Banitaan, North Dakota State University Fargo, ND, USA
6. Publishing
Selected and registered papers will be published by Applied Mechanics and Materials Journal.(ISSN: 1660-9336).
Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc. (Quoted from TTP offical website:http://www.ttp.net/1660-9336.html)
http://www.icmep.org/