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3rd Int. Conf. on Materials Engineering and Nanotechnology--SCOPUS, Ei Compendex

ICMEN

Date of beginning

Thursday, 19 July 2018

Duration

3 days

Deadline for abstracts

Sunday, 20 May 2018

City

Tokyo

Country

Japan

Contact

icmen@zhconf.ac.cn

E-Mail

This email address is being protected from spambots. You need JavaScript enabled to view it.

Expected participants

0

Participants

0

Memo

Publication:

All submissions will be peer reviewed by 2-3 reviewers. The registered and presented papers will be published into Materials Science Forum (ISSN print 0255-5476 / ISSN web 1662-9752) Indexed by Elsevier: SCOPUS, Ei Compendex (CPX).



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Submission:

Please submit your full paper to us:This email address is being protected from spambots. You need JavaScript enabled to view it.

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