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IEEE--The 6th Int. Conf. on Mechanical and Electronics Engineering--Ei Compendex, Scopus

ICMEE

Date of beginning

Sunday, 10 May 2020

Duration

3 days

Deadline for abstracts

Friday, 20 March 2020

City

Osaka

Country

Japan

Contact

Ms. Serene Lo

E-Mail

This email address is being protected from spambots. You need JavaScript enabled to view it.

Memo

Accepted papers can be published in * ICMEE proceedings* and made available through IEEE Xplore. Proceedings will be submitted for inclusion in leading indexing services, including <Ei Compendex, Scopus>, etc { History }The 1st ICMEE-Kyoto, Japan | IEEE Xplore ISBN: 978-1-4244-7480-6 The 2nd ICMEE-Hefei, China | AMM ISBN: 978-3-03785-286-6 The 3rd ICMEE-Tianjin, China | AMM ISBN: 978-3-03785-286-6 The 4th ICMEE-Beijing, China | AMM ISBN: 978-3-03785-286-6 The 5th ICMEE-Dalian, China | Matec ISSM: 2261-236X Vol.31 { Submission Method }1. Send your manuscript directly to conference official email: This email address is being protected from spambots. You need JavaScript enabled to view it. 2. Submit your paper through easychair system: http://confsys.iconf.org/submission/icmee2020