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Exploring the Design Freedom of Additive Manufacturing through Simulation

AM

Date of beginning

Monday, 10 December 2018

Duration

2 days

Deadline for abstracts

Monday, 20 August 2018

City

Helsinki

Country

Finland

Contact

Roger Oswald

E-Mail

This email address is being protected from spambots. You need JavaScript enabled to view it.

Memo

Call for Papers - NAFEMS Nordic Seminar: Exploring the Design Freedom of Additive Manufacturing through Simulation Attention: Dates changed to 10 - 11 December 2018 Helsinki, Finland Call for Papers         ---- abstract submission deadline: 20 August! >> Registration form Call for Papers   Additive manufacturing (AM), also called 3D printing, enables the manufacture of complex and intricate geometries without many of the constraints imposed by traditional manufacturing techniques.  As this technology advances and the costs of 3D printed parts continue to fall, AM will become a more prevalent and viable engineering and business solution.  In order to take full advantage of these technologies, new approaches to simulation and design need to be implemented in order to facilitate innovative and cost-effective solutions.  The aim of this seminar is to give delegates a comprehensive overview of the current state of AM, along with the challenges, risks, and opportunities - both for simulation engineers and for use within industry.  Some of the expected topics of discussion include: Optimization and design for AM – creating lightweight and/or functionally superior products Advanced materials modelling to show the effects of e.g. print parameters, print direction and part orientation on component microstructure Lattice or lightweight structure design and analysis Computational methods for prediction of e.g. residual stress and geometric distortion, surface topology, and microstructure (including defects) in additive manufactured components Use of simulation to help correct part distortion Process monitoring and feedback control for quality assurance and minimization of defects and residual stresses Multi-physics and multi-scale simulations of various additive manufacturing technologies Simulation showing effect of material imperfections on part performance (e.g. fatigue) Integration of optimization, design, and the requirements/restrictions of a given AM method Topology and shape optimization to take advantage of the design freedom offered by AM Optimization and control analysis of the manufacturing process Simulation of the manufacturing process for smart materials, sensors, nano-devices, etc. CAD to printed component part chain Validation and verification of AM products In essence, abstracts on the topics of computational modelling, simulation and optimization related to any of the additive manufacturing processes, materials, or printed components are welcome. The conference will include keynotes, technical presentations, and exhibits. You are invited to submit an abstract by latest 20 August to This email address is being protected from spambots. You need JavaScript enabled to view it. The seminar will be organized byNAFEMS NORDIC (www.nafems.org) in cooperation with the VTT Technical Research Centre of Finland (www.vttresearch.com) About VTTVTT Technical Research Centre of Finland Ltd is the leading research and technology company in the Nordic countries. We develop new smart technologies, profitable solutions and innovation services. We cooperate with our customers to produce technology for business and build success and well-being for the benefit of society. We use 4,000,000 hours of brainpower a year to develop new technological solutions. Please find more information about VTT here. Conference venue Hilton Helsinki KalastajatorppaKalastajatorpantie 100330 Helsinki, FinlandHotel website Hotel accommodationBooking linkYou may also book directly with the hotel by email This email address is being protected from spambots. You need JavaScript enabled to view it. / or by telephone +358945811. Please use reservation code G1NAFA when booking the rooms. Credit card details are needed to guarantee the booking. Sponsorship and exhibition opportunitiesInfopoint: 1 table + own poster or pop-up display: 500 EuroBooth space: 3 x 2 m, incl. 1 table, chairs: 800 EuroAll booth staff need to register as regular attendees. Sponsoring: Several opportunities are available (see below brochure) Exhibition-sponsoring-opportunities ContactNAFEMS Deutschland, Österreich, Schweiz GmbHNAFEMS Contact for NordicGriesstraße 20, 85567 Grafing b. München, GermanyPhone: +49 176 217 984 01, Fax: +49 3 22 11 08 99 13 41e-mail: This email address is being protected from spambots. You need JavaScript enabled to view it.  Details Event Type: SeminarLocation: Helsinki FinlandDate: December 10, 2018 In cooperation with VTT Technical Research Centre of Finland   >> Registration form Call for Papers Exhibition-sponsors   Registration Fees NAFEMS members:             Free 1)1) NAFEMS members can use seminar credits towards free attendance at this event. This event will charge four ­seminar credits per delegate. Members without seminar credits:                                               450 Euro   Non NAFEMS members:    600 Euro Students:                              Free 2)2) A limited number of students attend free of charge (first come, first serve – matriculation certificate required) Presenters need to pay regular participation fees. The registration fee includes conference attendance, proceedings, lunches, break refreshments and get together. Hotel accommodation is not included. All prices plus local VAT. Events - Cancellation Policy Please note NAFEMS cancellation policy for all DACH events is as follows: Cancellation up to 6 weeks before the event date: free of charge; Cancellation up to 1 week before the event date: 75% of registration fee non-refundable; Cancellation up to 1 week before the event date: all seminar credits non-refundable; No show at the event: 100% of registration fee non-refundable; NAFEMS will discuss the possibility of transferring to an alternative event/course, however an administration charge will be applicable. This policy is subject to change.