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【Ei indexing】The 6th Int'l Conference on Condensed Matter and Materials Physics (CMMP 2019)

CMMP 2019

Date of beginning

Tuesday, 20 August 2019

Duration

3 days

Deadline for abstracts

Saturday, 20 July 2019

City

Xi’an

Country

China

Contact

Rolin

E-Mail

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Memo

All the accepted papers will be published by Solid State Phenomena owned by TTP publishing in Switzerland and submitted to Ei Compendex databases for indexing. The conference is soliciting state-of-the-art research papers in the following areas of interest:Brittle fractureComputational physics of materialComputer Simulation in Soft MatterCrystal PhysicsDeformation experimentsDielectricsElectronic Structure & PhononsEnergy MaterialsFunctional Phase Transition PhysicsGraphene and carbon physicsHardening mechanismsIntermetallic Alloys and their Surfaces: Structure, Properties and ApplicationsLiquid CrystalsLiquids and Complex FluidsLiquids, Glasses & Amorphous SystemsLocal Structures of Functional MaterialsLow temperature physicsMagnetism and spintronicsMaterials for energyMaterials physicsMatter under Extreme ConditionsMetamaterialsMetamaterials, photonics and plasmonicMicroscopic processes of plastic deformationNanomagnetism Nano-materialsNanoscale physics and technologyNanoscale Physics at Low TemperaturesNeutron SpectroscopyNonlinear Dynamics Complexity and SynchronizationNovel MaterialsPhase TransitionsPolymer PhysicsQuantum Fluids and SolidsQuantum GasesQuantum InterfacesSemiconductor physics and devicesSoft condensed matter and biophysicsSolid State PhysicsStatistical physicsStrongly correlated systemsStructural Studies of NanomaterialStructure physicsSurfaces, Interfaces and Thin FilmsTheory of condensed matter