9th International Conference on Electrical and Electronics Engineering (ICEEE 2026)

Memo

9th International Conference on Electrical and Electronics Engineering (ICEEE 2026) March 30 ~ 31, 2026, Virtual Conference https://iceee2026.org/index SCOPE 9th International Conference on Electrical and Electronics Engineering (ICEEE 2026) serves as a premier global forum dedicated to advancing research, innovation, and industrial applications across the full spectrum of Electrical and Electronics Engineering. The conference aims to bring together leading researchers, academicians, industry professionals, and practitioners to exchange knowledge, discuss emerging trends, and explore cutting edge developments shaping the future of the field. ICEEE 2026 provides a dynamic platform for presenting original research contributions, breakthrough technologies, and stateoftheart reviews. The conference welcomes high quality submissions that highlight novel ideas, experimental results, theoretical advancements, and real world industrial experiences. Contributions may include research papers, case studies, survey articles, and project demonstrations that showcase significant progress in Electrical and Electronics Engineering.   Authors are invited to submit manuscripts that illustrate innovative methodologies, practical implementations, and impactful findings across a wide range of topics. Submissions may address, but are not limited to, the areas listed below, reflecting both foundational disciplines and emerging frontiers within the field. Topics of interest Power, Energy & Control Systems Smart Grids, Microgrids& Distributed Energy Systems Renewable & Sustainable Energy Technologies Power Electronics for Electric Vehicles & Transportation Fast Charging Systems & Vehicle to Grid (V2G) Technologies Energy Storage Systems & Battery Management High Voltage Engineering & Protection Systems Intelligent Control Systems & Automation Power System Stability, Optimization & Resilience Electronics, Circuits & Semiconductor Technologies Analog, Mixed Signal & RF Circuit Design High Performance Digital & Low Power Circuit Design Nanoelectronics, 2D Materials & Emerging Semiconductor Devices Neuromorphic, Spintronic & Quantum Devices VLSI, SoC, NoC & Hardware Security Electronic Packaging, Reliability & Thermal Management Flexible, Printed & Organic Electronics Electronic & Photonic Materials   Communication, Networking & Signal Processing 5G/6G Wireless Systems & Beyond Terahertz Communications & Reconfigurable Intelligent Surfaces (RIS) Optical Communication & Photonic Integrated Circuits Satellite, UAV & Space Communications IoT, Edge Computing & Cyber Physical Systems AI Driven Signal Processing & Communication Optimization Network Security, Privacy & Blockchain Enabled Systems Computational Imaging & Compressive Sensing Electromagnetics, Antennas & Wave Engineering Advanced Antenna Design (MIMO, mmWave, THz) Metamaterials & Meta surfaces Electromagnetic Compatibility (EMC/EMI) Computational Electromagnetics & Wave Propagation Embedded Systems, Robotics & Intelligent Machines Embedded AI, TinyML & Real Time Systems Robotics, Mechatronics & Autonomous Systems Autonomous Navigation, SLAM & Sensor Fusion Drones, UAV Navigation & Human Robot Interaction Avionics & Aerospace Electronics Cyber Physical Systems & Digital Twins Industrial Automation & Smart Manufacturing Embedded Security & Safety Critical Systems   Biomedical Engineering & Healthcare Technologies Biomedical Instrumentation & Wearable Health Devices Medical Imaging, Diagnostics & Bio signal Processing Neural Engineering, Brain Machine Interfaces & Prosthetics Bioelectronics, BioMEMS & LabonChip Systems AI in Healthcare & Computational Biology (EEE aligned) Sensing, Imaging & Remote Technologies Advanced Sensor Technologies, MEMS/NEMS & Smart Sensing LiDAR, Radar, Multispectral & Hyperspectral Imaging Earth Observation, Remote Sensing & Geospatial Technologies Virtual Instrumentation & Precision Measurement Systems Computing, AI & Emerging Technologies Machine Learning, Deep Learning & Generative AI for Engineering Trustworthy AI, Explainable AI & Safe ML Quantum Computing & Quantum Information Systems Cloud, Edge & Distributed Computing Architectures High Performance Computing & GPU/FPGA Acceleration Evolutionary Algorithms, Swarm Intelligence & Optimization   Interdisciplinary & Frontier Technologies Smart Cities, Intelligent Transportation & Infrastructure Internet of BioNano Things (IoBNT) Green Electronics & Sustainable Engineering Space Electronics, Radiation Hardened Systems & Deep Space Instrumentation AR/VR/MR Systems & Human Centered Computing Paper Submission Authors are invited to submit papers through the conference Submission System by January 24, 2026. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of nde conference will be published by International Journal on Cybernetics & Informatics (IJCI) (Confirmed). Selected papers from ICEEE 2026, after further revisions, will be published in the special issue of the following journals International Journal of Soft Computing, Mathematics and Control (IJSCMC) Electrical Engineering: An International Journal (EEIJ) Electrical and Electronics Engineering: An International Journal (ELELIJ)   Important Dates Submission Deadline : January 24, 2026Authors Notification : February 14, 2026Registration & Camera-Ready Paper Due : February 21, 2026 Contact Us Here’s where you can reach us : This email address is being protected from spambots. You need JavaScript enabled to view it. (or) This email address is being protected from spambots. You need JavaScript enabled to view it.