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6th Intl. Conf. on Energy Materials and Applications--Ei Compendex, Scopus

ICEMA

Date of beginning

Wednesday, 05 May 2021

Duration

3 days

Deadline for abstracts

Monday, 05 April 2021

City

Strasbourg

Country

France

Contact

Ms. Christina Chan

E-Mail

This email address is being protected from spambots. You need JavaScript enabled to view it.

Memo

==Proceedings:Accepted papers will be included in the conference proceedings, which will be index by Ei Compendex, Scopus, IET etc. major databases. ==History:Proceedings of ICEMA 2020 collected in IOP Conference Series: Materials Science and Engineering (ISSN: 1757-899X), vol.908. Proceedings of ICEMA 2019 collected in IOP Conference Series: Materials Science and Engineering (ISSN: 1757-899X), vol.628, indexed by EI Compendex and ScopusProceedings of ICEMA 2018 collected in IOP Conference Series: Materials Science and Engineering (ISSN: 1757-899X), vol.446, indexed by EI Compendex and ScopusProceedings of ICEMA 2017 collected in IOP Conference Series: Materials Science and Engineering (ISSN: 1757-899X), vol.222, indexed by EI Compendex and ScopusProceedings of ICEMA 2016 collected in Key Engineering Materials (ISSN: 1662-9795),vol. 708 (Click) , indexed by EI Compendex and Scopus ==Conference Chairs:Prof. Monica Siroux, INSA Strasbourg, France;Prof. David Lin, University of Tainan. ==Program Chairs:Prof. Jun Peng,University of Bedfordshire, Luton, UK;Prof. Nezihe Ayas, Eskisehir Technical University,Turkey;Prof. Jesus Toribio, University of Salamanca, Spain. ==Technical Committee:B. Narayanamoorthy,Jiangsu University,China;Chandra Shekhar Malvi,Madhav Institute of Technology & Science,India;Chun-Ping Jen, National Chung Cheng University, Taiwan;Dai-Viet N. Vo,Universiti Malaysia Pahang,Malaysia;Francesca Scalisi,University of Palermo,Italy;Francisco Lopez-Huerta, Centro de Investigación en Micro y Nanotecnología, Mexico;Haryati Yaacob, UTM,Malaysia;Hung-Pin Hsu,Ming Chi University of Technology,Taiwan;Kien Wen Sun, National Chiao Tung University,Taiwan;Miguel Lorenzo,University of Salamanca,Spain;Najma Laaroussi, Mohammed V University of Rabat, EST de Salé, Morocco;Ngoc-Chung Le, Da Lat University,Viet Nam;S. Harish, Kyushu University, Japan;Vijay Kumar Gupta,PDPM Indian Institute of Information Technology Design and Manufacturing, India;Yanan Hao, Beijing University of Posts and Telecommunications, China;Matteo Gentilucci, University of Camerino,Italy;Adhikari Rajendra Singh, Politecnico di Milano,Italy;Andoni Lasheras Aransay, Universidad del país vasco (UPV/EHU),Spain;Wegdan Wagdy El-Nadoury, Pharos University,Egypt;Ipek Guler, Cankaya University, Turkey.