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2022 2nd International Conference on Electronics, Circuits and Information Engineering (ECIE 2022)

ECIE 2022

Date of beginning

Friday, 07 January 2022

Duration

2 days

Deadline for abstracts

Monday, 03 January 2022

City

Xiamen

E-Mail

This email address is being protected from spambots. You need JavaScript enabled to view it.

Memo

2022 2nd International Conference on Electronics, Circuits and Information Engineering (ECIE 2022)   CONFERENCE INFORMATION: Website:http://www.confecie.org/ Conference Date:7th - 9th, January 2022 Venue: Xiamen, China Submission Deadline: 29th November 2021 Index:EI, Scopus   2022 2nd International Conference on Electronics, Circuits and Information Engineering (ECIE 2022) will be held from 7th to 9th, January 2022 in Xiamen, China. ECIE2022 is an international forum for scientists, engineers, and practitioners to present their latest research and development results in all areas of Electronics, Circuits, and Information Engineering. Conference topics mainly include but are not limited to Software engineering, Power and energy circuits, Optoelectronics, Single-chip microcomputer technology, etc. ECIE 2022 welcomes all high-quality research papers and presentations from related research fields.           Guest structure Conference Chair Prof. Gheorghe-Daniel Andreescu, Politehnica University Timisoara, Romania Prof. Abderrahim Maizate, HASSAN II UNVERSITY, Morocco   Committee members Organizing Committee Dr. Mohd Azrik bin Roslan, Universiti Malaysia Perlis, Malaysia A/Prof. Samila binti Mat Zali, Universiti Malaysia Perlis, Malaysia Dr. Latifah binti Mohamed, Universiti Malaysia Perlis, Malaysia Dr. Mohamad Nur Khairul Hafizi Bin Rohani, Universiti Malaysia Perlis, Malaysia Dr. Mohd Rafi Bin Adzman, Universiti Malaysia Perlis, Malaysia Dr. Syahrul Ashikin Azmi, Universiti Malaysia Perlis, Malaysia A/Prof. Akhtar Nawaz Khan, UET Peshawar, Pakistan A/Prof. Akshaya Kumar Pati, KiiT University, India Dr. Amparo FUSTER-SABATER, Institute of Physical and Information Technologies (CSIC), Spain   Technique Programme Committee Prof. Ghaleb HOBLOS, ÉCOLE D'INGÉNIEURS-ES GÉNÉRALISTES, France A/Prof. Linquan Bai, University of North Carolina at Charlotte, USA Prof. Kazi Md. Rokibul Alam, Khulna University of Engineering & Technology, Bangladesh Prof. Ashraf A.M. Khalaf, Minia University, Egypt A/Prof. T. R. Lenka, National Institute of Technology Silchar, India A/Prof. Dhafer Almakhles, Prince Sultan University, Saudi Arabia Dr. Mahajan Sagar Bhaskar, Prince Sultan University, Saudi Arabia A/Prof. Sushmita Sarkar, R V College of Engineering, India Dr. Robert Bestak, Czech Technical University in Prague, Czech Republic Prof. Weigang Hou, Chongqing University of Posts and Telecommunications, China Prof. Shuming Yang, Xi'an Jiaotong University, China     Keynote speaker Prof. Ghani Albaali Princess Sumaya University for Technology, Jordan             Prof. Debashis De MAKAUT, WB, India           Prof. Weigang Hou Chongqing University of Posts and Telecommunications, China           Prof. Kai Yang Huazhong University of Science and Technology (HUST), China             Prof. Jie Sun Fuzhou University, China               Prof. Haizhong Zhang      Fuzhou University, China         Call for papers The conference covers all aspects of technologies, applications, and services. The topics of interest are not limited to: VLSI Design and Fabrication Semiconductor Devices and Circuits Parallel and distributed computing Measurement and Control Technology and Instrument Test and Reliability Communication theories and systems Sensing and sensor networks Single-chip microcomputer technology Geographic information system Low power consumption and acquisition technology Electromagnetic Compatibility Electric vehicle technology Electrotechnics Electric machine and electric appliances Power electronics and its application Power and energy circuits Power System and Automation Power system reliability and safety Power system communication Circuit simulation and modeling Circuits and Systems Power quality and electromagnetic compatibility Computational Intelligence in Electrical Engineering Electronic design automation Multimedia system and signal processing Bionic information processing method and technology Distributed generation, fuel cell and renewable energy system High voltage and insulation technology Optoelectronics Process control Mechatronics and robotics Image-based modeling Integrated Circuit and System Design Application of computer and artificial intelligence in the power industry Inspection and imaging system Cryptography Analog circuit and signal processing Analog electronics Nanoelectronic circuit Embedded system Blockchain Artificial neural networks Human-computer interaction Software engineering Equipment simulation and modeling RF equipment and circuits Bioinformatics Real-time control Data Mining Digital electronics Digital circuits and signal processing Digital communications Communication and wireless systems Communication system security Network communication theory and technology Microelectronics Text mining Internet of Things Advanced power semiconductors Signal processing Information and communications engineering Remote sensing information acquisition and processing Medical information detection methods and techniques Predictive control Source and channel encoding Intelligent control system Intelligent information processing Natural language processing     Program 7th January 13:00-18:00 Registration 8th January 09:00-12:00 Speeches of Keynote Speakers 12:00-14:00 Lunch 14:00-17:30 Oral Presentations 18:00-19:30 Banquet 9th January 09:00-18:00 Academic Investigation       Participation Types: Package A: Only Attendance Package B: Abstract Submission + Oral Presentation Package C: Abstract Submission + Poster Presentation Package D: Full Paper Publication + Oral/Poster Presentation + Attendance Note: If you need paper publication and presentation both, please submit full paper. If you need to make presentation without publication, please submit abstract only. Submission Methods: If you choose Package D, please submit the full paper (word + pdf) to SUBMISSION SYSTEM If you choose Package A, B or C, please register via REGISTRATION SYSTEM.     Registration Fee Item Registration fee (By RMB)  Registration fee (By US Dollar)  Package D: Full Paper Publication + Oral/Poster Presentation + Attendance 3200RMB/per paper (4 pages) 500 USD/per paper (4 pages) Package D ≥ 3 2900RMB/per paper (4 pages) 450 USD/per paper (4 pages) Extra Pages (Begin at Page 5) 300RMB/per extra page 50 USD/per extra page Package A: Only Attendance 1200RMB/per person 200 USD/per person Package A≥ 3 1000RMB/per person(≥ 3 people ) 180 USD/per person(≥ 3  people) Package B: Abstract Submission + Oral Presentation 1500RMB/per person 250 USD/per person Package C: Abstract Submission + Poster Presentation 1500RMB/per person 250 USD/per person     6.Publication After a careful reviewing process, all accepted papers of ECIE 2022 will be published in Conference Proceedings and will be submitted to EI, Scopus for indexing. The submitted papers must not be under consideration elsewhere. Please submit the full paper, if presentation and publication are both needed. Please send the full paper(word+pdf) to the 【SUBMISSION SYSTEM】 7.CONTACT US Conference Secretary: Leah Li E-mail: This email address is being protected from spambots. You need JavaScript enabled to view it. LinkedIn: https://www.linkedin.com/in/yang-leah-li-b9b6271b9/ Tel: +86-17737319063 (WeChat) QQ: 978640953     Latest News: ECIE 2022 conference registration system opens now! Welcome Prof. Kai Yang from Huazhong University of Science and Technology (HUST), China to be our keynote speaker!