The Second International Conference on Mechanical, Electric and Industrial Engineering (MEIE2019)

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The Second International Conference on Mechanical, Electric and Industrial Engineering (MEIE2019)    About Conference（会议简介） The Second International Conference on Mechanical, Electric and Industrial Engineering (MEIE2019) will be held in Hangzhou, China during May 25-27, 2019.   MEIE2019 aims to provide a platform for scholars, experts and researchers from all over the world, to share the research experience and research results in the fields of mechanical engineering, electronic engineering or industrial engineering, to discuss solution and to investigate the future research direction. Publication and Index（出版与检索） Journal of Physics: Conference Series (IOP Publishing: JPCS)  Online ISSN: 1742-6596  Print ISSN: 1742-6588   Index: EI Compendex, CPCI, Scopus, etc.  Call for paper（会议征稿）   The second International Conference on Mechanical, Electric and Industrial Engineering (MEIE2019) accepts original and unpublished papers. The papers may include but are not limited to:   Mechanical Engineering: Biomechanics, Structural Analysis, Design and Drafting, Acoustic Engineering, Mechanical and Electrical Integration, Robotics, Computational Fluid Dynamics, Thermodynamics, Applied Mechanics, CAD/CAM/CIM, Dynamics and Vibration, Fluid Mechanics and Machinery, Fuels and Combustion, General mechanics, Machinery and Machine Design, Mechanical Power Engineering Industrial Engineering: Manufacturing System Engineering, Industrial Simulation, Industrial, Manufacturing Design, Process Engineering, Systems Engineering, Engineering Design, Quality Engineering, Ergonomics Electric Engineering: Analog Electronic Technology, Digital Electronic Technology, Microcomputer Principle and Application, Signals and Systems, Automatic Control Principle, Power Electronic Technology, Automatic Control System, Electrical Control Technology, Microcomputer Control Technology, Power System Analysis, Electrical Machinery, Insulation Technology, High Voltage Technology, HVDC Transmission Technology, Electromagnetic and Photonics, Microelectronics, Electronic Circuits   Submit paper（会议投稿） Submission System: http://papersub.icmeie.com/ E-mail: sec_zhengicmeie.com (+phone number)   Contact us（联系方式）   E-mail: sec_zhengicmeie.com   Tel: +86-13018056523   QQ: 2060402500