3rd Int. Conf. on Applied Materials and Electronics Engineering

Memo

The 2014 3rd International Conference on Applied Materials and Electronics Engineering (AMEE 2014) will be held from April 26-27, 2014 in Hong Kong. This conference is sponsored by International Association for Scientific and High Technology and International Science and Engineering Research Center, and it is technical co-sponsored by Trans Tech Publications. The conference will continue the excellent tradition of gathering world-class researchers and engineers engaged in the fields of Applied Materials and Electronics Engineering to meet and present their latest activities. You are cordially invited to attend this interesting event.

AMEE 2014, All accepted papers will be published in the Advanced Materials Research (ISSN:1022-6680). (Indexed by Elsevier: SCOPUS www.scopus.com and Ei Compendex (CPX) www.ei.org/. Cambridge Scientific Abstracts (CSA) www.csa.com, Chemical Abstracts (CA) www.cas.org, Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science) www.isinet.com, Institution of Electrical Engineers (IEE) www.iee.org, etc.)



The modified and extended excellence papers will be published by the special issues for the following Journals:

Materials Science (ISSN 2083–134X,SCIE, SciSearch, Impact Factor of 0.366 )

International Journal of Applied Mathematics and Statistics(ISSN 0973-7545, Ei Compendex,SCOPUS )