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Int. Conf. on Innovative Engineering Materials -SCOPUS, Ei Compendex

ICIEM

Date of beginning

Saturday, 20 August 2016

Duration

3 days

Deadline for abstracts

Thursday, 30 June 2016

City

Singapore

Country

Singapore

Contact

MS. Echo Nie

E-Mail

This email address is being protected from spambots. You need JavaScript enabled to view it.

Expected participants

0

Participants

0

Memo

All the registered and presented papers will be published in volume of Materials Science Forum

(ISSN: 1662-9752,Trans Tech Publications)

Indexed by Elsevier: SCOPUS, Ei Compendex (CPX).

_______

Conference Committee:

International Advisory Committees:

Prof. Tim White, Nanyang Technological University, Singapore;

Prof. WANG John, National University of Singapore, Singapore;

Prof. Min Wang,The University of Hong Kong, Hong Kong;

Conference Committee Chairs:

Prof. Dr. Mohd Hamdi Bin Abd Shukor, University of Malaya, Malaysia;

Prof. Ir. Dr. Farid Nasir bin Haji Ani, Universiti Technologi Malaysia, Malaysia;

Program Committee Chairs:

Prof. CHOW Gan Moog, National University of Singapore, Singapore;

Prof. Yu-Lun Chueh, National Tsing Hua University, Taiwan;

Prof. Masashi Hasegawa, Nagoya University, Japan;

Assoc. Prof. Yongsheng GAO, The Hong Kong University of Science and Technology, Hong Kong.