Conference: Int. SAP Conf. for Forest Products, Paper and Packaging



Name of conference  Int. SAP Conf. for Forest Products, Paper and Packaging 
Abbreviation   
Categories 
  • Engineering Management
Date of beginning  2018-10-16 
Duration 
City  Prague 
Country  Czech Republic 
Website  https://go.evvnt.com/226989-0?pid=5569 
Contact  Kerry Lenihan 
email  Kerry Lenihan 
Deadline for abstract  0000-00-00 
Expected participants 
Participants 
Memo  The two-day conference will attract business and IT-focused attendees representing a diverse set of companies including those active in wood, timber, panels, particleboards, commodity paper, specialty paper, paper packaging, flexible packaging, and metals packaging businesses. The conference will demonstrate how businesses are using the newest technologies such as the Internet of Things (IoT), automation, mobile technology, and the cloud to drive new revenue, improve margins and supplier relationships, increase productivity and asset performance, and reduce downtime. Global SAP Customers, SAP Experts and thought leaders will join together and showcase how SAP is helping to the FPPP industries grow into the future. The 2018 event will also be co-located with three other industry events: the International SAP Conference for Chemicals, the International SAP Conference for Mining and Metals and the International SAP Conference for Building Materials. Delegates will have the opportunity to move freely between all four events and benefit from cross-industry workshops, keynote presentations, tracks and partner exhibition. URL: Tickets: https://go.evvnt.com/226989-1?pid=5569. Prices: Early Bird: EUR 1090.0, Standard: EUR 1190.0. Speakers: SAP, BASF, Suzano Pulp & Paper, International Paper, MODEL AG, T.CON GmbH & Co. KG , Asia Pulp & Paper, Tieto, IDC, Sappi, Covestro, Johns Manville, UPM, Elopak GmbH, Evergreen Packaging, AICOMP, VALE. Time: 9:00 am to 4:30 pm. Venue details: Clarion Congress Hotel Prague, 33 Freyova, Praha 9, 190 00, Czech Republic. Category: Conferences / Engineering and Technology / Packaging. 

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